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Sputtering is a new type of physical vapor deposition (PVD) method.

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Sputtering is a new type of physical vapor deposition (PVD) method.

An orthorhombic magnetic field and an electric field are added between the sputtering target (cathode) and the anode, and the required inert gas (usually Ar gas) is charged in the high vacuum chamber. Under the action of the electric field, the Ar gas is ionized Ions and electrons, the target with a certain negative pressure, the electrons emitted from the target by the role of the magnetic field and the working gas ionization probability increases in the vicinity of the cathode to form a high density of plasma, Ar ion in Lorentz force The role of accelerated to the target surface, at a high speed bombardment of the target surface, so that the target is sputtered by the momentum to follow the principle of momentum conversion with high kinetic energy from the target surface to the substrate deposition film.

The main application of sputtering coating is: flat panel display, coated glass industry (mainly including architectural glass, automotive glass, optical film glass, etc.), thin film solar energy, surface engineering (decoration & tools), (magnetic, light) recording medium, microelectronics , Car lights, decorative coating, and so on.

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